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Nautiz X2 |
Nautiz X41 |
Nautiz X6 |
Algiz RT8 |
Algiz 8X |
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| Dimensions | 150 mm x 73 mm x 16 mm (5.9” x 2.9” x 0.6”) | 168 mm x 71 mm x 26 mm (6.6” x 2.8” x 1”) | 194 mm x 92 mm x 15 mm (7.6” x 3.6” x 0.6”) | 250 mm x 145 mm x 15 mm (9.8” x 5.7” x 0.6”) | 225 mm x 147 mm x 24 mm (8.8” x 5.7” x 0.9”) |
| Weight | 230 g (8.11 oz) | 270 g (9.5 oz) | 380 g (13.4 oz) | 635 g (22.4 oz) | 990 g (2.18 lbs) |
| Processor | MediaTek Helio P22 MT6762, 8 cores 2.0 GHz | MediaTek Helio P22 MT6762, 8 cores 2.0 GHz | Qualcomm® Snapdragon 626 MSM8953 Pro, 8 cores 2.2 GHz | Qualcomm® Snapdragon 625 MSM8953, 8 cores 2.0 GHz | Intel® Pentium® N3710 1.60 GHz (2.56 GHz boost) 64-bit quad-core |
| Graphics | IMG PowerVR GE8320 | IMG PowerVR GE8320 | Adreno 506 | Adreno 506 | Intel HD Graphics 405 |
| Display | 4.7" capacitive multi-touch 1280x720 pixels Sunlight readable Glove/rain mode Corning® Gorilla® Glass |
4" capacitive multi-touch 480x800 pixels Sunlight readable Glove/rain mode Corning® Gorilla® Glass |
6” capacitive multi-touch (10 points) 1080x1920 pixels Sunlight readable Glove/rain mode Corning® Gorilla® Glass |
8” capacitive multi-touch (10 points) 1920x1200 pixels Sunlight readable Glove/rain mode Corning® Gorilla® Glass |
8” capacitive multi-touch 1280x800 pixels Sunlight readable, 600 nits Glove/rain mode Chemically strengthened glass |
| Battery | Standard 3.8V 3600 mAh (13.68Wh) Field replaceable Extended 3.8V 7200 mAh (27.36Wh) Field replaceable |
3.8V 4400 mAh (16,72 Wh), field replaceable | 3.8V 8000 mAh (30.4 Wh), field replaceable | 3.8V 8200 mAh (31.16 Wh), field replaceable | Standard 7.6V 5900 mAh (44.84Wh) Hot-swappable Extended 7.2V 10350 mAh (74.52Wh) Hot-swappable |
| Buttons | Front Home, task manager, scan, return Side 2x FN, volume up/down, power |
Front Numeric 23 keys, with backlight Side 2x FN, power |
Front F1, F2, F3, power Side FN, volume up/down |
Front Power, F1, F2, F3, Volume up/down |
Front Power, lock/touch mode, menu, home, F1, F2 |
| Ports | Micro USB 2.0, OTG Docking connector Back connector for expandability 3.5mm headphone jack 1x micro SDXC (256GB) 1x micro SIM |
Type-C, OTG Docking connector 1x micro SDXC (128GB) 1x Micro-SIM |
Type-C, OTG Qualcomm quick charge 3.0 GNSS antenna connector Back connector for expandability 1x micro SDXC (256 GB) 2x nano SIM |
Type-C, OTG GNSS antenna connector Docking connector supporting HDMI, Ethernet, USB Back connector for expandability 3.5mm headphone jack 1x micro SDXC (128 GB) 1x Nano-SIM |
DC power jack 2x USB A 3.0 Micro HDMI Docking connector Back connector for expandability Side expansions 1x micro SDXC 1x micro SIM |
| Communication | Cellular (WWAN) Global: 2G (850,900,1800,1900) 3G (1,2,5,8) 4G/LTE (1,3,7,8,20,34,38,39,40,41) NA: 2G (850,900,1800) 3G (1,2,4,5) 4G/LTE (1,2,3,4,5,7,12,17,28A/B,41) Wireless LAN 2.4 GHz + 5 GHz 802.11 a/b/g/n/r/ac PAN BT 5.0 LE NFC 13.56MHz ISO14443A/B, ISO15693 Audio Rear-facing speaker Microphone |
Cellular (WWAN) Global: 2G (850,900,1800,1900) 3G (1,5,8) 4G/LTE (1,3,5,7,8,20,34,38,39,40,41) North America: 2G (850, 1800, 1900) 3G (1, 2, 4, 5) 4G/LTE (1,2,3,4,5,7,12,17,28A/B,41) Wireless LAN 2.4GHz/5GHz 802.11a/b/g/n/r/ac PAN BT V5.0 LE NFC 13.56 MHz ISO 14443A/B, ISO 15693 Audio Rear-facing speaker Microphone |
Cellular (WWAN) 2G (850,900,1800,1900) 3G (1,2,5,8) 4G/LTE (1,2,3,4,5,7,8,17,20,28,38,39,40,41) Carrier certification Canada (Bell, Rogers, Telus) Wireless LAN 2.4 GHz + 5 GHz 802.11a/b/g/n/ac PAN BT V4.1 NFC 13.56 MHz ISO 14443A/B, ISO 15693 Audio Headphone support via Type-C Front-facing speaker Microphone |
Cellular (WWAN) 2G (850,900,1800,1900) 3G (1,2,5,8) 4G/LTE (1,2,3,4,5,7,8,12,13,17,20,25,28,38,39,40,41) Wireless LAN 2.4GHz/5GHz 802.11a/b/g/n/ac PAN BT V4.1 Up to 150m NFC 13.56 MHz ISO 14443A/B, ISO 15693 Audio Rear-facing speaker Microphone |
Cellular (WWAN) 2G, 3G, 4G/LTE, Verizon LTE Sierra EM7355 (NA. M.2 Type) Sierra EM7305 (EU. M.2 Type) Sierra EM7455 (Verizon. M.2 Type) Wireless LAN 2.4 GHz + 5 GHz 802.11 ac, a/b/g/n PAN BT V4.2 Audio Front-facing speaker Microphone |
| Positioning | GPS/AGPS/GLONASS/Galileo/BEIDOU | GPS/AGPS/GLONASS/Galileo/BEIDOU | Dedicated u-blox GNSS receiver GPS/GLONASS/Galileo/BeiDou |
Dedicated u-blox GNSS receiver GPS/GLONASS/Galileo/BeiDou |
Dedicated u-blox GNSS receiver GPS/GLONASS/Galileo/Beidou |
| Scanner | 1D Laser (Zebra SE965HP) 2D Imager (Honeywell N6603) |
1D Laser (Zebra SE965) 2D Imager (Honeywell N6703HD) |
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| Cameras | Rear 8 megapixel with autofocus and flash |
8 megapixels with autofocus and flash | Rear 13 megapixel with auto-focus and flash Front 5 megapixel |
Rear: 13 megapixel with autofocus and flash Front: 5 megapixel |
Rear 8 megapixel with autofocus and flash Front 2 megapixel |
| Sensors | Accelerometer Vibration Proximity Ambient light |
Gyroscope Accelerometer Magnetometer Proximity Ambient light Compass |
Gyroscope Compass Accelerometer Pressure Proximity Ambient light |
Gyroscope Compass Accelerometer Pressure Proximity Ambient light |
Ambient light |
| Environment | Operating -20°C to 60°C (-4°F to 140°F) MIL-STD-810G, Method 501.5 Procedure II Storage -40°C to 60°C (-40°F to 140°F) MIL-STD-810G, Method 501.5/502.5 Procedure I Drop / Shock 26 drops from 1.2 m (4 ft) MIL-STD-810G, Method 516.6 Procedure IV Vibration MIL-STD-810G, Method 514.6 Procedures I, II Sand / Dust IP65, IEC 60529 Water IP65, IEC 60529 Humidity 0 ～ 95% (non-condensing) MIL-STD-810G, Method 507.5 Altitude 4572 m (15.000 ft) MIL-STD-810G, Method 500.5 Procedure I |
Operating -20°C to 60°C (-4°F to 140°F) MIL-STD-810G, Method 501.5 Procedure II Storage -40°C to 60°C (-40°F to 140°F) MIL-STD-810G, Method 501.5/502.5 Procedure I Drop / Shock 26 drops from 1.22 m (4 ft) MIL-STD-810G, Method 516.6 Procedures IV Vibration MIL-STD-810G, Method 514.6 Procedure I & II Sand / Dust IP65, IEC 60529 Water IP65, IEC 60529 Humidity 0% ～ 95% (non-condensing) MIL-STD-810G, Method 507.5 Altitude 4572 m/15 000 ft. MIL-STD-810G, Method 500.5 Procedures I |
Operating -20°C to 55°C (-4°F to 131°F) MIL-STD-810G, Method 501.5/502.5 Procedure II Storage -40°C to 70°C (-40°F to 158°F) MIL-STD-810G, Method 501.5/502.5 Procedure I Drop / Shock 6 drops from 1.5m, concrete surface IEC 68-2-32:1990 Vibration MIL-STD-810G, Method 514.6 Procedure I Sand / Dust IP67, IEC 60529 Water IP67, IEC 60529 Humidity 0% ～ 95% (non-condensing) MIL-STD-810G, Method 507.5 Procedure II Altitude 4572 m (15 000 ft) MIL-STD-810G, Method 500.5 Procedures I & II EMC/EMI MIL-STD-461F, CE101, CE102, CS101, CS114, CS115, CS116, RE101, RE102, RS101, RS103 |
Operating -20°C to 60°C (-4°F to 140°F) MIL-STD-810G, Method 501.5/502.5 Procedure II Storage -40°C to 70°C (-40°F to 158°F) MIL-STD-810G, Method 501.5/502.5 Procedure I Drop / Shock 26 drops from 1.2 m (4 ft) MIL-STD-810G, Method 516.6 Procedures IV Vibration MIL-STD-810G, Method 514.6 Procedure I Sand / Dust IP67, IEC 60529 Water IP67, IEC 60529 Humidity 0% ～ 95% (non-condensing) MIL-STD-810G, Method 507.5 Procedure II Altitude 4572 m (15 000 ft.) MIL-STD-810G, Method 500.5 Procedures I & II EMC/EMI MIL-STD-461F: CE101, CE102, CS101, CS114, CS115, CS116, RE101, RE102, RS101, RS103 |
Operating -20°C to 60°C (-4°F to 140°F) MIL-STD-810G, Method 501.5 Procedure II Storage -40°C to 70°C (-40°F to 158°F) MIL-STD-810G, Method 501.5/502.5 Procedure I Drop / Shock 26 drops from 1.2 m (4 ft) MIL-STD-810G, Method 516.6 Procedure IV Vibration MIL-STD-810G, Method 514.6 Procedures I, II Sand / Dust IP65, IEC 60529 Water IP65, IEC 60529 Humidity 0 ～ 95% (non-condensing) MIL-STD-810G, Method 507.5 Altitude 4572 m (15.000 ft) MIL-STD-810G, Method 500.5 Procedure I |
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